Chemical nickel

In the case of chemical nickel plating, the layer is deposited onto the component without current. Chemical nickel is particularly suitable for components with complex geometries, since this process allows the use of contour-accurate and uniform layers. Phosphorus installation rates in the range of 6 – 12% ensure different layer properties. Schlötter offers a wide range of high, medium and low-pore processes (NiP) as well as dispersion separations.

Chemical nickel layers are e.g. used in:

Printed circuit board manufacturing (PCB), electronics, corrosion protection (CRC), mechanical engineering

Beschreibung

Produkt/Anwendung

18002 Electroless Nickel SLOTONIP CT 20
18003 Electroless Nickel SLOTONIP NP 1150

Allround process with combined additive system for depositions with a P-content of 6 - 9 % at a high deposition rate of app. 18 - 20 µm.

18007 Activator PDI

Ionogenic activator for activating non-conductors for subsequent metal deposition. The activator contains palladium.

18014 Electroless Nickel SLOTONIP 90

Deposition of nickel-phosphorus layers a with phosphorus content of 10.5 - 11.5 %. Especially high corrosion resistance.

18015 Electroless Nickel SLOTONIP 90 K

Deposition of Ni-P layers with a P-content of 10 - 12 % in the coatings. Especially high corrosion resistance. Ammonium-free variant.

18020 Electroless Nickel SLOTONIP 60

Deposition of Ni-B layers. Thin layers for metallizing of non-conducting material (plastic, ceramic).

18031 Electroless Nickel SLOTONIP 30 1

Electrolyt for the deposition of Ni-P coatings on metals and non conductive materials with a P-content of 7 - 10 %.

18033 Electroless Nickel SLOTONIP 30 3

Electrolyte for the deposition of Ni-P coatings on metals and none conductive materials with a P-content of.

18070 Electroless Nickel SLOTONIP 70 K

Deposition of Ni-P layers with 7 - 10 % P; allround process; 4 - 5 MTO.

18071 Electroless Nickel SLOTONIP 70 A

Deposition of Ni-P layers with a P-content of 9 - 10 %.

18080 Electroless Nickel SLOTONIP 80

Deposition of Ni-P layers. Thin layers for metallizing of non-conducting material (plastic, ceramic).

18092 Wetting Agent SLOTONIP AP 12

Wetting agent for the use in electroless Ni processes to avoid pores.

18101 Post Treatment SLOTOCHEM NI 10

Post-treatment for electroless Ni layers on Pd basis to improve the solderability

18103 Post Treatment SLOTOCHEM NI 30

Allows soldering of electroless nickel deposits and is especially recommended for Electroless Nickel SLOTONIP 90.

18122 Electroless Nickel SLOTONIP VN 20

Electrolyte for electroless pre-nickel plating of aluminium after zincate.

18187 Electroless Nickel SLOTONIP LP 1870
18222 Electroless Nickel SLOTONIP NP 1220

Electrolyte for the deposition of Ni-P layers with a P-content of 6 - 9 % of at a low temperature (80 °C).